Constructing 3D package component broadband electrical models with correct DC values

Jinwoo Choi,Zhaoqing Chen,Wiren D Becker,J Morsey,Barry J Rubin

Electrical Performance of Electronic Packaging and Systems（2010）

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摘要

Accurate channel simulations of package interconnections require passive and causal models that faithfully represent the full frequency response from tens of gigahertz to DC. In this paper, we propose and test a method to create accurate models extending to DC while retaining passivity and causality. The model derived by this method is suitable for transient simulations of packaging interconnect systems.

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关键词

electronics packaging,frequency response,integrated circuit interconnections,3d package component,broadband electrical models,causal models,channel simulations,correct dc values,package interconnections,passive models,transient simulations,serdes,causality,component,modeling,passivity,resistance,component model,scattering parameters,solid modeling,mathematical model

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