Interconnection requirements and multi-die integration for FPGAs

Aminur Rahman,J J Schulz,R Grenier,Kaushik Chanda,M J Lee, D Ratakonda,Hongyu Shi,Zuyi Li,Karthik Chandrasekar,Junfeng Xie,D E Ibbotson

Interconnect Technology Conference（2013）

Cited 3|Views14

No score

Abstract

Die stacking technology with high-density interconnect is enabling new product architectures and capabilities. Silicon interposer based stacking with through silicon via (TSV) has gained traction for high-performance applications. Some of the challenges in manufacturing technology, supply-chain strategy, design tools and infrastructure are being addressed to enable broader technology adoption. This paper provides an overview of Field Programmable Gate Array (FPGA) application trends which are driving the need for advanced die-stacking technologies. We present design and manufacturing considerations for stacking technologies and highlight lessons learned from a recent technology demonstration vehicle.

Translated text

Key words

field programmable gate arrays,integrated circuit interconnections,three-dimensional integrated circuits,fpga,die stacking technology,field programmable gate array application,high density interconnect,interconnection requirements,multidie integration,silicon interposer based stacking,through silicon via,manufacturing,bandwidth,silicon

AI Read Science

Must-Reading Tree

Example

Generate MRT to find the research sequence of this paper

Chat Paper

Summary is being generated by the instructions you defined