A Package-Integrated Chireix Outphasing RF Switch-Mode High-Power Amplifier

Microwave Theory and Techniques, IEEE Transactions(2013)

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摘要
This paper describes the design and implementation of a package-integrated Chireix outphasing RF switch-mode power amplifier (PA). The optimum loading conditions, based on class E, and the Chireix compensation elements are provided to the active devices by a dedicated low-loss bondwire-based transformer power combiner that enables a very small form factor and low cost. The realized prototype achieved 70.6-W peak power with 73% peak drain efficiency at 2.3 GHz and 28 V, and up to 81% peak drain efficiency at 2.2 GHz and 20 V. When operated for maximum power at 28 V, it reached 53.5%/43.5% average drain/total efficiency for a 9.6-dB peak-to-average-power-ratio W-CDMA signal at 2.3 GHz with low ACLR1/2 levels ( -49/ -56 dBc after memoryless digital predistortion). Moreover, from 2.1 to 2.4 GHz, the realized PA demonstrated more than 50% drain efficiency across > 260, > 160, and > 80 MHz at 6-, 8-, and 10-dB back-off, respectively.
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uhf integrated circuits,uhf power amplifiers,compensation,integrated circuit bonding,integrated circuit packaging,power combiners,transformers,wires (electric),chireix compensation element,pa,rf switch-mode high-power amplifier,efficiency 43.5 percent,efficiency 53.5 percent,efficiency 73 percent,frequency 2.1 ghz to 2.4 ghz,gain 10 db,gain 6 db,gain 8 db,low-loss bondwire-based transformer power combiner,memoryless digital predistortion,noise figure 9.6 db,optimum loading condition,package-integrated chireix,peak-to-average-power-ratio w-cdma signal,power 70.6 w,voltage 20 v,voltage 28 v,base station,chireix combiner,bondwire,broadband,class e,outphasing transmitter,power amplifier (pa),switch mode,transformer
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