Method for improved CMP pad conditioning performance

Gregory E Menk,Sivakumar Dhandapani,Charles C Garretson,S S Chang,Jason Garcheung Fung,Sungfang Tsai

Advanced Semiconductor Manufacturing Conference（2010）

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摘要

A new pad conditioning arm design enables the use of closed-loop control (CLC) to improve conditioning performance throughout the life of a pad and disk pair. Measured pad conditioner torque is used to monitor and control the conditioning and polish processes in situ and in real time. The CLC system maintains process performance throughout pad life by adjusting the conditioner down force to compensate for process drift, such as the loss of diamond aggressiveness as the disk ages.

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关键词

chemical mechanical polishing,closed loop systems,planarisation,cmp pad conditioning performance,chemical mechanical planarization,closed-loop control,pad conditioner torque,pad conditioning arm design,polish process,diamond like carbon,force,process control,closed loop control,films,real time,torque

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