Minimizing displacement return currents in multilayer via structures

Andreas Hardock,Sebastian Muller,Xiaomin Duan,Heinzdietrich Bruns,Christian Schuster

Electrical Performance of Electronic Packaging and Systems（2012）

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摘要

A fast approach for the calculation of ground via return currents using the contour integral method is presented. From the analysis of the displacement currents design rules for optimized vias in multilayered boards are derived.

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关键词

printed circuits,contour integral method,displacement return current minimization design,ground via return currents,multilayer via structures,multilayered boards,printed circuit board,return current,via

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