172 GHz divide-by-two circuit using a 0.25-µm InP HBT technology

Newport Beach, CA(2009)

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摘要
We report an advanced InP/InGaAs double heterojunction bipolar transistor technology using aggressive scaling in device layout and epitaxial stack. The device employs a 220 Aring highly doped base and a 1200 Aring collector designed to support current densities in excess of 12 mA/mum2. Transistors with emitter width of 0.25-mum have exhibited simultaneous measured f T and f max frequencies in the 500 GHz range. Frequency divide-by-two digital circuits designed and fabricated with this InP bipolar technology have demonstrated maximum clock frequency of 172 GHz. Manufacturing capabilities for mixed-signal circuits of increased complexity are also reported with improvements in resolution and bandwidth.
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关键词
iii-v semiconductors,current density,gallium arsenide,heterojunction bipolar transistors,indium compounds,inp-ingaas,aggressive scaling,double heterojunction bipolar transistor technology,epitaxial stack,frequency 172 ghz,size 0.25 mum,manufacturing,digital circuits,gain
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