New Reflow Soldering and Tip in Buried Box (TB2) Techniques for Ultrafine Pitch Megapixels Imaging Array
2008 58th Electronic Components and Technology Conference（2008）
Key words
flip-chip devices,lead bonding,soldering,flip-chip bonding technology,heterogeneous imaging arrays,interconnection technology,maskless soft solder buried box filling technique,micro-tube fabrication,reflow soldering technology,thermocompression hybridization,thermocompression insertion technology,tip in buried box techniques,ultra-fine pitch,ultrafine pitch megapixels imaging array,underbump metallization
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