Fully considered layout variation analysis and compact modeling of MOSFETs and its application to circuit simulation

Takuji Tanaka,Akira Satoh,Mitsuru Yamaji,Osamu Yamasaki,Hiroshi Suzuki,Tsuyoshi Sakata, Yoshio Inoue,Masaru Ito,Seiichiro Yamaguchi,Hiroshi Arimoto

Edinburgh（2008）

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摘要

We have developed a total system of circuit design to treat dependency of MOSFET electric characteristics on layout patterns. Our new methodology with two-step multivariate analysis realizes highly reliable compact modeling, and its application to SPICE simulation significantly improves accuracy of circuit modeling. Our system is a powerful tool of design for manufacturing in 65 nm technology node and beyond.

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关键词

mosfet,spice,circuit simulation,digital simulation,electric properties,integrated circuit layout,mosfet electric characteristics,spice simulation,circuit design,circuit modeling,compact modeling,layout variation analysis,multivariate analysis,design for manufacture,lithography,variational analysis,manufacturing

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