Signal and Power Integrity Co-Simulation for Multi-layered System on Package Modules
2007 IEEE International Symposium on Electromagnetic Compatibility（2007）
Key words
finite difference methods,mixed analogue-digital integrated circuits,network-on-chip,mixed signal system,multilayer finite difference method,multilayered system,package modules,power distribution network,power integrity,signal distribution network,signal integrity,simultaneous switching noise,split planes
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