Recent progress of heterogeneous integration for semiconductor materials and microsystems

Heterogeneous integration utilizes a paste-and-cut approach to alleviate the limitations of monolithic integration by synthesizing and fabricating each material subsystem independently and then assemble them on a receptor substrate at the proper node of the integration sequence. The technique enables new and novel functionalities by integrating dissimilar semiconductors material systems to assemble a microsystem. We report recent developments of GeOI substrates, high-brightness LED, and opto-MEMS to illustrate versatility of this approach