Continuous Multistrand Assembly Techniques For Ag Clad Superconducting Wire

K Demoranville,P Antaya,C Martin,Q Li,Gn Riley, S Hancock, M Simpson, J Marquardt, D Tatelbaum

IEEE Transactions on Applied Superconductivity(1999)

Cited 0|Views1
No score
Abstract
A method to continuously combine and deform silver, er has been developed. This technique has been used to fabricate multifilament superconducting tapes consisting of Bi-2223, high temperature superconducting precursors. Results show that silver has the unique ability to be bonded together in a continuous strand process without requiring a protective atmosphere, The approach uses a continuous process to combine relatively fine wires that are aligned in the desired configuration, held in intimate contact and heat-treated to promote metallurgical bonding. Silver grain growth across strand interfaces has been documented in processed tapes and lengths approaching 100 meters have been fabricated. Engineering critical current densities (J(e),) as high as 19,000 amps/cm(2) (77K, self-field, 1 mu V/cm) have been recorded in short samples.
More
Translated text
Key words
bismuth compounds,calcium compounds,critical current density (superconductivity),grain growth,heat treatment,high-temperature superconductors,materials preparation,multifilamentary superconductors,silver,strontium compounds,superconducting tapes,Ag clad superconducting wire,Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O/sub 10/,Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O/sub 10/-Ag,continuous multistrand assembly,continuous strand process,critical current density,grain growth,heat-treatment,high temperature superconducting precursors,metallurgical bonding,multifilament superconducting tapes,strand interfaces
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined