Novel Micro Electro Mechanical Systems (Mems) Packaging For The Skin Of The Satellite

Aerospace Conference, 2004. Proceedings. 2004 IEEE(2004)

引用 2|浏览0
暂无评分
摘要
This paper includes a discussion of the novel packaging techniques that are needed to place MEMS based thermal control devices on the skin of various satellites, eliminating the concern associated with potential particulates from integration and test or the launch environment. Protection of this MEMS based thermal device is achieved using a novel polymer that is both IR transmissive and electrically conductive. This polymer was originally developed and qualified for space flight application by NASA at the Langley Research Center. The polymer material, commercially known as CPl, is coated with a thin layer of ITO and sandwiched between two window-like frames. The packaging of the MEMS based radiator assembly offers the benefits of micro-scale devices in a chip on board fashion, with the level of protection generally found in packaged parts.
更多
查看译文
关键词
temperature control,satellites,thermal conductivity,space flight,packaging,mechanical systems,skin,electric conductivity,testing,microelectromechanical systems,polymers,particulates,conducting polymers
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要