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Transient analysis and fault compensation during module failure in paralleled power modules

Yeong Jia Cheng,E.K.K. Sng

Applied Power Electronics Conference and Exposition, 2004. APEC '04. Nineteenth Annual IEEE（2006）

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Abstract
This paper investigates the transient behavior of a power supply comprising paralleled power modules when one of its modules fails. A detailed transient analysis is presented using the principle of superposition and the state variable technique to investigate the effects of the faulty module on system performance. A fault compensation strategy is proposed to allow smooth ride-through during fault....
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Key words
Transient analysis,Multichip modules,Power system stability,Switches,Power supplies,System performance,Robustness,Analytical models,Buck converters,Voltage
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