A 100-GHz distributed amplifier in chip-size package

Satoshi Masuda,K Kobayashi,Hidehiko Kira,Masayuki Kitajima, Masakazu Takesue,Yoshihisa Kamiya,Kazukiyo Joshin

Microwave Symposium Digest, 2003 IEEE MTT-S International（2003）

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摘要

We developed a new millimeter-wave plastic chip size package (CSP) to operate up to 100 GHz by using a thin-film substrate. It has a flip-chip distributed amplifier with inverted microstrip lines that has a bandwidth of beyond 110 GHz. The CSP amplifier achieved a gain of 7.8 dB and a 3 dB bandwidth of 97 GHz, and operated up to 100 GHz as an amplifier. To our knowledge, this value is the highest operating frequency reported to date for a distributed amplifier sealed in a plastic CSP.

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关键词

mimic,mmic amplifiers,chip scale packaging,distributed amplifiers,flip-chip devices,millimetre wave amplifiers,wideband amplifiers,100 ghz,110 ghz,7.8 db,97 ghz,ehf,mm-wave chip scale package,flip-chip distributed amplifier,inverted microstrip lines,millimeter-wave csp,plastic csp,thin-film substrate,bandwidth,thin film,millimeter wave,assembly,chip,flip chip,plastics,microstrip line

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