90 GHz f/sub T/ SiGe HFET with fully optical self-aligned sub 100 nm gate
Santa Barbara, CA, USA(2002)
Abstract
Advanced material properties and sophisticated layer structures of SiGe hetero field-effect transistors are the basis for expected and partly demonstrated elevated RF and noise performance of these devices. However, a lack of lateral device optimization, due to lithography restrains and non self-aligned technology processes often limits the electrical performance of these transistors. Self-aligned technology concepts for hetero field-effect transistors often fail because of the incompatibility between metal gates and high temperature process steps. The new fully optical, self-aligned integration concept presented here uses a replacement-gate structure to overcome this problem.
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Key words
ge-si alloys,junction gate field effect transistors,semiconductor materials,100 nm,90 ghz,sige,sige hfet,electrical characteristics,fully optical self-aligned technology,replacement gate structure,length measurement,field effect transistor,scattering parameters,material properties
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