Crosstalk included eye diagram estimation of high-speed and wide I/O interposer channel for 2.5D / 3D IC

Sumin Choi,Kiyeong Kim,Daniel H Jung,J J Kim,Jaemin Lim,Hyunsuk Lee,Hyungsoo Kim,Yongju Kim

Electrical Performance of Electronic Packaging and Systems（2014）

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摘要

In this paper, crosstalk included eye diagram of high-speed and wide I/O interposer channels are simulated and analyzed. To analyze the crosstalk effect of various substrate channels, silicon, glass, and organic interposers are simulated and compared under the same physical dimensions. In addition, crosstalk included eye diagrams are accurately estimated in short time using 8 worst case input signals. The estimated eye diagrams are investigated at data rate of 10 Gbps.

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关键词

crosstalk,three-dimensional integrated circuits,3d ic,crosstalk included eye diagram estimation,high-speed interposer channel,wide i/o interposer channel,eye diagram,glass interposer,organic interposer,silicon interposer,metals,estimation,silicon,glass

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