Advancing Foundry Technology with Scaling and Innovations

Shien-Yang Wu,C. Y. Lin,S. H. Yang,J. J. Liaw,J. Y. Cheng

International Symposium on VLSI Technology, Systems, and Applications（2014）

Cited 32|Views17

Key words

CMOS memory circuits,SRAM chips,foundries,integrated circuit interconnections,three-dimensional integrated circuits,transistors,3D IC system integration technology,Moore law,SRAM,TSMC,business growth,customer product,dedicated IC foundry,foundry technology,interconnect,leading-edge CMOS technology,logic technology platform,more-than-Moore specialty technology,scaling transistor,value-added components

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