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Fabrication of low dark-count PureB single-photon avalanche diodes

Microelectronics Technology and Devices(2014)

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摘要
Single-photon avalanche diodes (SPADs) have been fabricated in Si by using PureB (Pure Boron) chemical-vapor deposition (CVD) to create both a nanometer-thin anode junction and robust light-entrance window. The device is sensitive to low-penetration-depth radiation such as UV light and low-energy electrons. Ideal I-V characteristics are obtained for operation in Geiger mode, whereas biasing is well above the breakdown voltage. The dark count rate (DCR) can be as low as 5 Hz at room temperature for an active area of 7 μm2. An implicit guard ring as small as 0.5 μm wide is implemented using an n-enhancement implantation in the central region of the diode, thus achieving a high fill-factor.
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anodes,avalanche photodiodes,boron,chemical vapour deposition,nanoelectronics,b,cvd,dcr,geiger mode,i-v characteristics,spads,si,uv light,chemical-vapor deposition,dark count rate,high fill-factor,implicit guard ring,low dark-count pureb single-photon avalanche diode fabrication,low-energy electrons,low-penetration-depth radiation,n-enhancement implantation,nanometer-thin anode junction,robust light-entrance window,temperature 293 k to 298 k,avalanche breakdown,photodiode,pure boron chemical vapor deposition,single-photon avalanche diode (spad),ultrashallow junctions
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