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Low-cost TSH (through-silicon hole) interposers for 3D IC integration

John H Lau,Chingkuan Lee,Chaujie Zhan,Shengtsai Wu,Y Chao,Mingji Dai,Ramin Tain,Hengchieh Chien,Chunhsien Chien,Renshin Cheng,Yuwei Huang,Yuanchang Lee,Zhicheng Hsiao,Wenli Tsai,Paicheng Chang,Huanchun Fu,Yumei Cheng,Liling Liao,Weichung Lo,Mingjer Kao

Electronic Components and Technology Conference（2014）

Cited 10|Views45
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Abstract
In this investigation, a SiP (system-in-package) which consists of a very low-cost interposer with through-silicon holes (TSHs) and with chips on its top- and bottom-side (a real 3D IC integration) is studied. Emphasis is placed on the fabrication of a test vehicle to demonstrate the feasibility of this SiP technology. The design, materials, and process of the top-chip, bottom-chip, TSH interposer, and final assembly will be presented. Shock and thermal cycling tests will be preformed to demonstrate the integrity of the SiP structure.
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Key words
system-in-package,three-dimensional integrated circuits,sip,tsh interposer,real 3d ic integration,through-silicon holes,very low-cost interposer,strips,resists,silicon,system in package,tin
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