Chebyshev Filter Design Using Vias as Quasi-Transmission Lines in Printed Circuit Boards
Microwave Theory and Techniques, IEEE Transactions （2015）
摘要
This paper presents a novel concept for microwave filter design using vias (plated through-holes) in multilayered printed circuit boards. By using the concept that vias accompanied by a sufficient number of ground vias in close proximity can be approximated as transmission lines in a certain frequency range, corresponding effective impedances and phase velocities for different configurations of vias and ground vias are deduced. By controlling these transmission-line parameters, standard microwave filter methodology is applied for the design of low-pass and bandpass Chebychev filters in the frequency range of 5-20 GHz. Measurements and full-wave simulation results are presented as validation. Advantages and limitations of the proposed method are discussed.
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关键词
chebyshev filters,high-pass filters,low-pass filters,microwave filters,printed circuits,transmission lines,vias,frequency 5 ghz to 20 ghz,full-wave simulation,ground vias,high-pass chebychev filter design,low-pass chebychev filter design,microwave filter design,multilayered printed circuit boards,phase velocity,plated through-holes,quasitransmission lines,standard microwave filter methodology,transmission-line parameters,filter,microwave components,passive filter,plated through holes,printed circuit board (pcb),via,band pass filters,low pass filters,high pass filters,impedance,chebyshev approximation
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