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Formation of Ag/Al Screen-Printing Contacts on B Emitters

Photovoltaics, IEEE Journal of  (2015)

Cited 42|Views22
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Abstract
In this study, the contact formation process of Al containing Ag screen-printing pastes to BBr3-based B emitters on Si is investigated. Therefore, a detailed scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy study of top-view and cross-sectional samples was conducted. The possible influence of a SiN∞:H antireflection coating was considered by comparing contacts with and without a SiN∞:H layer. To analyze the role of the glass frit in the paste, the contact formation of pastes without glass was examined. The results indicate that the Ag/Al contact spots grow below the Si surface/SiN∞:H layer. The glass frit is only indispensable for etching the antireflection layer-it is not needed for melting the metal in the screen-printing paste. The realized experiments lead to a phenomenological model for the contact formation process of Al containing screen-printing pastes to boron emitters.
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Key words
x-ray chemical analysis,aluminium,antireflection coatings,boron,etching,integrated circuits,metallisation,scanning electron microscopy,silver,ag-al-b,sem,si,sinx:h antireflection coating,antireflection layer,boron emitters,contact formation,cross-sectional samples,energy-dispersive x-ray spectroscopy,glass frit,melting,phenomenological model,screen-printing contact formation,screen-printing paste,screen-printing pastes,metallization,p+si,scanning electron microscopy (sem),screen-printing
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