A novel silicon-containing ethynylarene resin as heat-resistant thermoset

A series of novel processable and heat-resistant silicon-containing resins (PSA-E resins) were successfully synthesized by the reaction of 1,3,5-tris-(4-ethynylphenyl)benzene (TEPHB) with silylene-acetylene polymer (PSA resin) with high yields. The molecular structure, thermal curing processes and thermal properties were characterized by FTIR, (HNMR)-H-1, GPC, DSC and TGA. The results indicated that these novel resins could be melted at room temperature and thermally cured at 200-250 degrees C with low exothermal heat. Owing to the complete crosslinking of ethynyl groups, the Td(5) (temperature of 5% weight loss) for all the thermosets are above 500 degrees C, and the overall char yields were above 87% at 900 degrees C under nitrogen.