The effect of nano-Cu particles on mechanical properties of micro-joining joint with lead-free solder
MATERIALS PROCESSING TECHNOLOGY, PTS 1-4(2011)
Abstract
The effect of nano-Cu particles on mechanical bend reliability of micro-joining joint with Sn-3.5Ag lead free solder was studied in this paper. The results show that 0.5% nano-Cu composite lead free solder show significantly better shearing strength and mechanical bend fatigue properties than eutectic Sn-3.5Ag solder paste, 1.0% nano-Cu composites and 1.5% nano-Cu composites. The further analysis shows that adding nano-Cu particles make much effect on intermetallic (IMC) in the interface of micro-joint and the inside of the solder joint. The different interface of micro-joining joint induced different mechanical properties.
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Key words
nano-Cu particles,Sn-3.5Ag lead-free solder,shearing property,mechanical bend fatigue property
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