沿面闪络和丝状电流对光电导开关的损伤机理
Diangong Jishu Xuebao/Transactions of China Electrotechnical Society(2010)
Abstract
通过对电极间隙为3mm和8mm半绝缘GaAs光电导开关损伤实验研究发现,引起开关损伤的主要机制是沿面闪络和丝状电流。沿面闪络是在高偏置电压条件下GaAs材料在热传导过程中表现的熔化?再结晶现象,对开关造成了致命性损伤;而丝状电流是开关在非线性工作模式下由于存在负微分电导效应(NDC),形成的高浓度电子?空穴等离子体通道,芯片内产热和冷却之间达到了动态平衡,开关处于光控预击穿状态,存在可恢复性和不可恢复性两类损伤。
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Key words
Filamention,Injury,Semi-insulating (SI) GaAs photoconductive switch,Surface flashover
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