Bi对Sn-0.3Ag-0.7Cu无铅钎料熔点及润湿性能的影响
Hanjie Xuebao/Transactions of the China Welding Institution（2008）
Abstract
研究了添加适量的Bi元素对低银型Sn-0.3Ag-0.7cu无铅钎料合金性能的影响,应用差示扫描量热仪和SAT-5100型润湿平衡仪对Sn-0.3Ag-0.7Cu-x Bi(x=0,1,3,4.5)钎料的熔点、润湿性能作了对比试验分析.结果表明,一定量Bi元素的加入可以降低Sn-0.3Ag-0.7Cu钎料合金的熔点,并改善其润湿性能.但过多的Bi元素会导致钎料的液固相线温度差增大,塑性下降,造成焊点剥离缺陷.综合考虑得到Sn-0.3Ag-0.7Cu-3.0 Bi无铅钎料具有最佳的综合性能.
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Key words
Fillet lifting,Lead-free solder,Melting point,Wettability
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