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声表面波器件内连技术探讨

Yan WU,Ying ZHU,Yi-wen LUO,Dong-mei LIU,Hong-qun JIANG

Yadian Yu Shengguang/Piezoelectrics and Acoustooptics（2007）

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Abstract
声表面波(SAW)器件的内连技术是指将光刻出的压电芯片上的电极与外壳上对应的内引脚连接起来,从而实现电信号的连通.由于内连质量很难通过中间过程的检测完全确定,因此,内连技术成为影响SAW器件性能和可靠性的关键之一.该文介绍了对各种内连技术的原理和工作过程,并比较其不同特点,探讨了适合SAW器件发展要求的技术和方法.
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Key words
Interconnection technology,SAW filter,Wire bonding
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