Package Level Simulation And Verification Of Microsystems

This paper presents a modified concept of a generalized Nodal Analysis Method (NAM) to theoretically model the packaged MEMS device and simplify the package-level simulation of microsystems. Non-device elements are included and a new kind of distributed node is defined to expand the usability of NAM. Experiment verification based on DSCM and LDV are also carried out to validate the simulated results.