Localized heating and bond formation at solder/Cu interface induced by ultrasonic friction
14th International Conference on Electronic Materials and Packaging, EMAP 2012（2012）
摘要
The intense generation of frictional heat in fast rubbing process can locally melt contacting solids and join materials. This letter decribes a localized heating and soldering at solder/Cu interface induced by ultrasonic friction. Through probing the mean surface temperature of sliding solder bump, the transient nature of frictional heat generation can be deduced, which is associated with the interfacial thermo-mechanical interaction during ultrasonic slip. A thin molten solder film forms at the frictional interface and reacts with the Cu top surface metallization (TSM) pad, producing nano-scale Cu 6Sn5 intermetallic compounds (IMCs), with some tiny Ag3Sn particles attaching on them. The effects of ultrasonic sound on the interfacial reaction of IMCs were investigated, and the shear strengths of ultrasonic-soldered joints with different bonding times were also characterized. © 2012 IEEE.
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关键词
bonds (chemical),chemical reactions,copper alloys,metallisation,nanostructured materials,shear strength,silver alloys,soldering,solders,thin films,tin alloys,ultrasonic applications,Ag3Sn,Cu6Sn5,TSM pad,bond formation,fast rubbing process,frictional heat generation,frictional interface,interfacial reaction,interfacial thermo-mechanical interaction,join materials,localized heating,mean surface temperature,melt contacting solids,nanoscale intermetallic compounds,shear strengths,sliding solder bump,solder,soldering,thin molten solder film,top surface metallization pad,ultrasonic friction,ultrasonic slip,ultrasonic sound effect,ultrasonic-soldered joints,
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