An assessment method of electronic packaging reliability based on rough set theory

Electronic Packaging Technology and High Density Packaging(2012)

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摘要
With the continuous improvements of IC integration,the electronic packaging reliability became more and more important. As a result, how to evaluate the reliability of the electronic packaging precisely has become a problem to be solved. In this paper, an index system from the packaging material, packaging process and packaging test is put forward. Then, considering many uncertainties induced by the absence and decentralization of electronic packaging information, a rough set theory based model is established to assess the electronic packaging reliability. It is shown from the case study that the model can make the assessment more objective and feasible because it can take more accounts of the uncertainties in the electronic packaging reliability analysis.
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关键词
index system,rough set theory,assessment method,continuous improvement,integrated circuit testing,integrated circuit reliability,electronic packaging information,electronic packaging reliability analysis,ic integration,continuous improvements,packaging process,packaging test,integrated circuit packaging,packaging material
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