Warpage analysis on package-on-package (PoP) for package stacking process
Electronic Packaging Technology and High Density Packaging(2012)
摘要
Since large warpage would make the solder ball not contact with the bond pad during reflow and induce open circuit, PoP Warpage becomes a main reliability issue in surface mount assembly. Differing from other researches, this study is focus on the SMT process effect on PoP warpage. A “displacement ratio” is adopted as a key factor for the comparison between two different assembly processes. A simplified finite element model is established for the numerical analysis. From the simulation results, it is found that if other conditions are same, the SMT process I (pre-stack one) will generate larger warpage. From the comparison of displacement ratio, the risk of open circuit in process I is higher.
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关键词
package-on-package,warpage analysis,assembling,numerical analysis,surface mount technology,finite element model,pop,finite element analysis,reliability,package stacking process,surface mount assembly
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