Research on microsystem interposer designer software with through silicon via

Yanzhu Lv,Min Miao,Xiaofei Wang,Huifen Liu,Xin Sun,Zhensong Li,Yuexia Zhang,Xiaoqing Zhang

Electronic Packaging Technology and High Density Packaging（2012）

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摘要

This paper introduces the research and development of Interposer Designer© software for microsystem interposer designing. First, An algorithm that screen coordinate is converted to OpenGL coordinate is presented. The algorithm allows the user to draw cube, cylinder, hollow cube, hollow cylinder and other basic graphics elements for Si Interposer with the mouse, handling them in any position of the space. The development platform of Interposer Designer is Microsoft Visual C++6.0 and OpenGL. Designers can draw 2D or 3D interposer model through two ways, basic graphics operation or inputting interposer model parameters. Then, the function of software to extract the equivalent circuit model of the interposer model and output the RLC parameters are explained. The software may give output in .csv format.

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关键词

2d interposer model,research and development,tsv,micromechanical devices,coordinate convertion algorithm,hollow cube,rlc circuits,opengl coordination,rlc parameter,three-dimensional integrated circuits,si interposer,microsystem interposer designer software,equivalent circuit,visual basic,microsoft visual c++6.0,through silicon via,equivalent circuits,silicon,.csv format,screen coordinate conversion,c++ language,integrated circuit design,hollow cylinder,si,elemental semiconductors,3d interposer model,electronic engineering computing

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