Investigation of the relationship of the melt structures and solidification behaviors of Cu-Sb70 alloy explored by electrical resistivity method

According to the behaviors of resistivity-temperature of Cu-Sb70 melt, which suggests a partly reversible temperature-induced liquid structure transitions (LST) could occur in this alloy, in this paper, we investigated the dependence of solidification on the liquid state. Both resistivity and temperature were measured to track solidification process. The results show that the nucleating undercooling of the melt which experienced the LST increased and the solidified time decreased. Meanwhile, the solidified microstructures refined evidently, with the microscopic pattern of primary phase changes from disordered pillarlike dendrites into homotaxic ones. Moreover, it is verified that the microstructures would be different if the reversible part of the LST was restrained. The new phenomena and results reflected in this paper suggest that grasping the rules of melt structure change with temperature before material processing will give help for controlling the solidification more effectively and finally resulting in more ideal microstructures.