High aspect ratio etching technology of micro holes and trenches structure

High aspect ratio etching technology of micro holes and narrow trenches structure has been developed systemic based on Alcatel AMS200 deep etching equipment. By reducing the ratio of etching time, passivation time, and depassivarion time, shortening the cycle of three pulse, a high aspect ratio near 1:25 of two-dimensional hexagonal hole arrays structure have been implemented, and the diameter of the holes is 2.1 micro meter. By increasing the power of below electrode, and reducing the etching rate, a high aspect ratio near 1:25 of narrow trenches has been realized successfully, and the width of the trenches is 2.3 micro meter.