声—振动多功能传感器减振封装研究
Journal of Henan Science and Technology(2013)
Abstract
本文利用ANSYS(有限元分析软件),对微振动-声多功能传感器的封装关键部件—减振橡胶和芯片粘合体进行实体建模和计算机模拟(模态分析、静态和瞬态分析)。通过模拟结果确定空心模型最佳尺寸。
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