Development of new assembly techniques for a silicon micro-vertex detector unit using the flip-chip bonding method

Y. Saitoh,H. Takeuchi,M. Mandai,H. Kanazawa,J. Yamanaka,S. Miyahara,M. Kamiya, Y. Fujita,Y. Higashi,H. Ikeda,M. Ikeda,S. Koike, T. Matsuda,H. Ozaki, M. Tanaka,T. Tsuboyama,S. Avrillon,S. Okuno,J. Haba,H. Hanai,S. Mori,K. Yusa,C. Fukunaga

Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment（1994）

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Abstract

Full-size models of a detector unit for a silicon micro-vertex detector were built for the KEK B factory. The Flip-Chip Bonding (FCB) method using a new type anisotropic conductive film was examined. The structure using the FCB method successfully provides a new architecture for the silicon micro-vertex detector unit.

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flip chip

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