A Simulation Of The Influence Of Corrosive Agents In Electrodeposition On Microprofiles

JOURNAL OF THE ELECTROCHEMICAL SOCIETY(1991)

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摘要
Using a numerical simulation, the effect of: corrosive agents consumed at the transport-limited rate on developing metal deposit profiles is characterized as a function of the relative rates of corrosion and electrodeposition; the relative importance of ohmic and kinetic resistances in determining the current distribution; and the geometry of the system. Corrosive agents are shown to blunt sharp features even for current efficiencies as high as 99%. Significant leveling is demonstrated if the current distribution is dominated by charge transfer kinetics and the rate of corrosion is on the order of the rate of electrodeposition.
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关键词
kinetics,materials science,nuclear reactions,chemical reactions,relative rate,films,thin films,reaction kinetics,current density,chemical reaction,electrolysis,thin film,mathematical model,numerical simulation,mathematical models,dispersions,lysis,deposition,metals,elements,analytical chemistry,corrosion,charge transfer,mixtures
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