Challenges and Innovations in Dual Damascene Polymer RDL with 2 Μm Pitch and Beyond

Benjamin D. Briggs,Ryan Ley,Chris Bencher,Roger Quon, C. C. Chuang, Peng Suo, Andy Chang Bum Yong, Luisa Bozano, Jorge Fernandez,Prayudi Lianto,Niranjan Khasgiwale,Siddarth Krishnan

PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024（2024）

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关键词

RDL,Dual Damascene,Fan-out,Chiplet,FOWLP,Heterogenous Integration

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