Package Design Optimization and Materials Selection for Stack Die BGA Package
IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat No04CH37585)（2004）
关键词
ball grid arrays,circuit optimisation,delamination,design of experiments,microassembling,optimised production technology,thermal management (packaging),DOE matrix,biomaterial coupling,delamination intensity,design of experiments,die stack fine pitch BGA,geometrical variations,interfacial adhesion,interfacial delamination,lead-free applications,materials selection,moisture,mold compound delamination,package design optimization,package structure,packaging materials,silicon die stacking,solder reflow temperatures,stack die BGA package,stack packages,test factors,thermal excursion,thermomechanical modelling
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要