多注射头集成电路(IC)塑封模具的研制
Engineering Plastics Application（2006）
Abstract
针对传统单、双注射头塑封模具存在的流道长不易注满型腔,塑封料需要预热,更换模盒麻烦等缺陷,设计开发出一种新型的多注射头塑封模具,并以电子产品PC817为例,重点介绍了塑封模具总体结构、模盒、注射系统和注射板平衡设计的技术要点。
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Key words
plastics packaging mould,multi-gate pole,floating injection system,general mould structure,mould box
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