Effect of Spherical Silica Particle Size and Their Matches on Flowability of Epoxy Molding Compound for IC Packaging

By means of matching filling of five grades of spherical silica with the particle size of 2 μm,3 μm,5 μm,10 μm,and 20 μm,respectively,the epoxy molding compounds(EMC) for intergrated circuits(IC) were manufactured.Using classical particle accumulation theory,the particle distribution according with Dinger-Funk-Alfred equation was calculated by Matlab simulation software,and the optimal particle size formulations were obtained.Adding the mixed silica according to the above optimal formulations into epoxy resin,the EMCs were manufactured by twin-roll compounding at 95～105 ℃.Measurement of rotating and capillary rheometers showed that the matching filling of silica with different particle size could improve the flowability of EMC.