A 275mW heterogeneous multimedia processor for IC-stacking on Si-interposer

ISSCC(2011)

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摘要
Most data-intensive operations for multimedia applications such as image processing, vision, and 3D graphics require high external memory bandwidth. In augmented-reality (AR) processors [1], both 3D graphics and vision operations are required, so memory bandwidth becomes even more critical. In [1], however, memory bandwidth is not considered, floating-point processing is not supported, and there is no cache memory for texturing, which is a performance bottleneck of common graphics pipelines. In this work, a heterogeneous multimedia processor is presented to process various mobile multimedia applications in a single chip on Si-interposer for high memory bandwidth. The implemented processor has 4 key features: (1) A transceiver pool (TRx) that reconfigures strength of output drivers according to the channel loss for IC-stacking on Si interposer, (2) A mode-configurable vector processing unit (MCVPU) for frame level parallelism, (3) An energy-efficient unified filtering unit (UFU) with adaptive block selection (ABS) algorithm for memory-access-efficient texturing, and (4) a unified shader (US) with floating-point scalar processing elements (SPE) and partial special function units (PSFU) to enhance graphics processing perform ance and quality. With these techniques, we achieve 1.7χ frame rate and 8χ memory bandwidth improvement in full AR operation.
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关键词
transceivers,multimedia systems,mcvpu,psfu,driver circuits,cache storage,mode-configurable vector processing unit,frame level parallelism,energy-efficient unified filtering unit,computer graphics,mobile multimedia applications,channel loss,graphics processing performance,spe,vector processor systems,ufu,partial special function units,data-intensive operations,output drivers,graphics processing quality,3d vision operations,abs algorithm,heterogeneous multimedia processor,external memory bandwidth,transceiver pool,memory-access-efficient texturing,silicon,augmented reality,floating-point scalar processing elements,adaptive block selection algorithm,3d graphics operations,silicon-interposer,unified shader,coprocessors,power 275 mw,chip scale packaging,graphics pipelines,ar processors,cache memory,augmented-reality processors,electronic engineering computing,floating-point processing,ic-stacking,floating point arithmetic,pipeline processing,graphics,three dimensional,energy efficient,bandwidth,filtering,energy efficiency
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