Improved RF Devices for Future Adaptive Wireless Systems Using Two-Sided Contacting and AlN Cooling

Lis K. Nanver,Hugo Schellevis,Tom L. M. Scholtes,Gianpaolo Lorito,Francesco Sarubbi,Viktor Gonda,Milos Popadic,Koen Buisman,Leo C. N. de Vreede,Cong Huang,Silvana Milosavljevic,Egbert J. G. Goudena

IEEE Journal of Solid-State Circuits（2009）

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摘要

This paper reviews special RF/microwave silicon device implementations in a process that allows two-sided contacting of the devices: the back-wafer contacted silicon-on-glass (SOG) substrate-transfer technology (STT) developed at DIMES. In this technology, metal transmission lines can be placed on the low-loss glass substrate, while the resistive/capacitive parasitics of the silicon devices can be...

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关键词

Radio frequency,Adaptive systems,Cooling,Silicon devices,Varactors,Circuits,Microwave devices,Electromagnetic heating,Microwave technology,Transmission lines

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