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热致封装效应对MEMS固支梁谐振频率的影响

Li Ming,Song Jing,Tang Jieying

Journal of Semiconductors（2008）

Cited 2|Views12
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Abstract
MEMS器件的封装效应显著而复杂,其中由贴片封装引起的结构热失配是封装效应的主要成因.论文在前期封装-器件耦合行为模型的基础上,利用激光多普勒测振仪实验验证了贴片工艺的热致封装效应对固支梁器件性能的影响.结果表明,贴片前后固支梁的谐振频率发生显著变化,并沿芯片表面表现出明显的分布特征.考虑封装效应的理论模型可以较好地预测该结果,为MEMS系统的器件-封装协同设计提供理论指导.
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Key words
resonant frequency,co-design,MEMS,fixed-fixed beam,packaging effect
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