The role of Ni and Au on transparent film of blue LEDs
Solid-State Electronics(2003)
Abstract
The role of Ni, Au on transparent film of light emitting diodes (LEDs) has been studied by I–V and optical transmission measurement. When fixing Ni layer at 5 nm, the thickness of Au layer in the Ni/Au bilayer was changed from 2 to 20 nm, the forward voltage (Vf) of LEDs decreased rapidly with increasing the thickness of Au layer. When fixing Ni layer at 10 nm, the thickness of Ni layer in the Ni/Au bilayer was changed from 2 to 20 nm, the results show that the Vf does not monotonically decrease with increasing the thickness of Ni layer. It is found that Au layer play a role of spreading the injection current while the Ni layer play a role of reducing the Schottky barrier height. The effect of thermal treatment on the behavior of the ohmic contact of Ni/Au to p-GaN contacts was also investigated by I–V measurement. It is found that it exists a reversible process of contact resistance when the Ni/Au to p-type GaN contacts is annealed in air and N2 ambient alternatively.
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Key words
ohmic contact,thermal treatment,light emitting diode,contact resistance
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