几种工业丝用超有光切片的固相聚合——固相聚合(SSP)切片性能分析
Synthetic Technology & Application(2010)
Abstract
笔者针对上期报道[1]中的4个SSP切片进行了性能分析。结果发现常规性能变化趋势与CP相同,DEG在SSP前后基本保持不变;SSP切片的熔融结晶温度Tm c基本相当,比CP的约低15℃左右;冷结晶温度Tc差异较大,与CP趋势一致;SSP切片分子质量分布与CP趋势不同;流变数据发现对温度的敏感性排序为3SSP、4SSP、1SSP、2SSP。
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Key words
SSP chip,property,rheological property,PET,DSC
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