3-D electronics interconnect for high-performance imaging detectors

We describe work that extends three-dimensional (3-D) patterned overlay high-density interconnect (HDI) to high-performance imaging applications. The work was motivated by the rigorous requirements of the multiple-pulse imager for dynamic proton radiography. The optical imager has to provide large (>90%) optical fill factor, high quantum efficiency, 200-ns inter-frame time interval, and storage fo...