Single Wafer Immersion Process Incorporating a Novel Megasonics Configuration with an Advanced IPA Vapor Condensation Dry

J. J. Rosato, E. G. Baiya,J. A. Imonigie,M. R. Yalamanchili, E. Hansen

SOLID STATE PHENOMENA（2003）

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Abstract

A novel single wafer immersion processing system that incorporates multiple megasonics transducers with a rapid IPA vapor condensation dry is shown to deliver excellent process results with reduced cycle times and relatively high throughputs.

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Key words

single wafer,immersion,surface preparation,wafer cleaning,etching,megasonics,IPA vapor drying

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