Residual Stress Of Pt Films With Ti And Tiox Adhesion Layers On Si And Sapphire Substrates

The residual stress and morphology of Pt electrodes were investigated using Ti and titanium oxide (TiOx) adhesion layers. Conventional or rapid thermal annealing (RTA) was used to compare the morphologies. The morphology depended on the substrate, adhesion layer, and annealing conditions, with large hillocks formed for electrodes incorporating Ti on Si. Electrode stacks utilizing TiOx adhesion layers resulted in residual stresses that were similar to 50% less than those with Ti. Ba0.60Sr0.40TiO3 (BST) thin films were deposited onto several electrodes to investigate the integrity of the electrode/film heterostructures. Delamination or roughening of the film was observed depending on the adhesion layer.