Spreading Dynamics Of Tin, Bismuth And Some Lead-Free Solders Over Copper Substrate

The spreading of a liquid on a solid surface is very important in a number of practical applications. In this work spreading dynamics of liquid metals and solders alloys were established to determine the mechanism of spreading. The spreading dynamics of bismuth, tin, 99.3%Sn-0.7wt%Cu alloy, 99.8%Bi-0.2%Cu alloy and 60%Sn-40%Pb were studied by using sessile droplet method. Tests were carried out at a temperature range from 280 degrees C to 350 degrees C over a copper substrate. Results showed a discontinuous decrease of spreading velocity as a function of time.