航天器单机内PCB焊点低气压放电试验研究
Spacecraft Environment Engineering(2013)
Abstract
在轨航天器单机内部存在低气压放电风险,因此对于工作电压等级较高的PCB,需要采用放电防护工艺和措施.文章针对几种现有的放电防护工艺,试验测量了不同工艺条件下的焊点起晕电压.试验结果表明,球形焊点的起晕电压高于正常焊点;焊点之间是否开槽对起晕电压无明显影响;涂三防漆的焊点起晕电压显著高于未涂漆焊电极.试验结果能够为航天器用PCB焊点放电防护工艺评估提供指导.
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Key words
printed circuit board(PCB),solder fillet,corona inception voltage,protection of discharging,low-pressure discharge
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